Invention Grant
- Patent Title: Clip interconnect with encapsulation material locking feature
- Patent Title (中): 夹具互连与封装材料锁定功能
-
Application No.: US13189074Application Date: 2011-07-22
-
Publication No.: US08575747B2Publication Date: 2013-11-05
- Inventor: Randolph Cruz
- Applicant: Randolph Cruz
- Applicant Address: US CA Milpitas
- Assignee: Intersil Americas Inc
- Current Assignee: Intersil Americas Inc
- Current Assignee Address: US CA Milpitas
- Agency: Fogg & Powers LLC
- Main IPC: H01L23/12
- IPC: H01L23/12

Abstract:
A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys.
Public/Granted literature
- US20120133037A1 CLIP INTERCONNECT WITH ENCAPSULATION MATERIAL LOCKING FEATURE Public/Granted day:2012-05-31
Information query
IPC分类: