Invention Grant
- Patent Title: Stacked bulk acoustic resonator
- Patent Title (中): 堆叠体声共振器
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Application No.: US13074094Application Date: 2011-03-29
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Publication No.: US08575820B2Publication Date: 2013-11-05
- Inventor: Alexandre Augusto Shirakawa , Paul Bradley , Dariusz Burak , Stefan Bader , Chris Feng
- Applicant: Alexandre Augusto Shirakawa , Paul Bradley , Dariusz Burak , Stefan Bader , Chris Feng
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H03H9/15

Abstract:
A stacked bulk acoustic resonator includes a first piezoelectric layer stacked on a first electrode, a second electrode stacked on the first piezoelectric layer; a second piezoelectric layer stacked on the second electrode, and a third electrode stacked on the second piezoelectric layer. The stacked bulk acoustic resonator further includes an inner raised region formed in an inner portion on a surface of at least one of the first, second and third electrodes, and an outer raised region formed along an outer perimeter on the surface of the at least one of the first, second or third electrodes. The outer raised region surrounds the inner raised region and defines a gap between the inner raised region and the outer raised region.
Public/Granted literature
- US20120248941A1 STACKED BULK ACCOUSTIC RESONATOR AND METHOD OF FABRICATING THE SAME Public/Granted day:2012-10-04
Information query
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