A sensor unit with at least one magnetic field sensor element, at least one application specific integrated circuit (ASIC) and at least one magnet are arranged in a capsule housing on at least one leadframe. The capsule housing is surrounded by a sensor encapsulation and is intended to have smaller dimensions so as to allow it to be positioned in the encapsulating mold with less effort and at the same time in the exact position. For this purpose, it is provided that the capsule housing has a number of fixing aids adapted in their outer dimensions to an injection mold assigned to the sensor encapsulation.