Invention Grant
- Patent Title: Interconnect system
- Patent Title (中): 互连系统
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Application No.: US13225141Application Date: 2011-09-02
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Publication No.: US08575953B2Publication Date: 2013-11-05
- Inventor: David W. Henry , Kiley Beard , William Thurston , Jason W. Farris , Bradley Smith
- Applicant: David W. Henry , Kiley Beard , William Thurston , Jason W. Farris , Bradley Smith
- Applicant Address: US KS Kansas City
- Assignee: Interconnect Devices, Inc.
- Current Assignee: Interconnect Devices, Inc.
- Current Assignee Address: US KS Kansas City
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Main IPC: G01R31/00
- IPC: G01R31/00
Abstract:
A test contact may include a first portion having an open-ended rounded shape. The first portion may define an opening therethrough. The test contact may include a second portion having a curved structure. The first portion and the second portion may be formed integrally, and the second portion may be configured to contact a portion of a device lead.
Public/Granted literature
- US20110312229A1 Interconnect System Public/Granted day:2011-12-22
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