Invention Grant
US08575993B2 Integrated circuit with pre-heating for reduced subthreshold leakage
有权
具有预热功能的集成电路可降低亚阈值泄漏
- Patent Title: Integrated circuit with pre-heating for reduced subthreshold leakage
- Patent Title (中): 具有预热功能的集成电路可降低亚阈值泄漏
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Application No.: US13247694Application Date: 2011-09-28
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Publication No.: US08575993B2Publication Date: 2013-11-05
- Inventor: Paul Penzes , Mark Fullerton
- Applicant: Paul Penzes , Mark Fullerton
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L35/00
- IPC: H01L35/00

Abstract:
Certain semiconductor processes provide for the use of multiple different types of transistors with different threshold voltages in a single IC. It can be shown that in certain ones of these semiconductor processes, the speed at which high threshold transistors can operate at decreases with decreasing temperature. Thus, the overall processing speed of an IC that implements high threshold transistors is often limited by the lowest temperature at which the IC is designed (or guaranteed) to properly function. Embodiments of a system and method that overcome this deficiency by “pre-heating” the IC (or at least portions of the IC that implement the high threshold transistors) such that the IC can operate at a frequency (once pre-heated) higher than what would otherwise be possible for a given, minimum temperature at which the IC is designed (or guaranteed) to properly function at are provided.
Public/Granted literature
- US20130043927A1 Integrated Circuit With Pre-Heating For Reduced Subthreshold Leakage Public/Granted day:2013-02-21
Information query
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