Invention Grant
- Patent Title: Stripline-to-waveguide transition including metamaterial layers and an aperture ground plane
- Patent Title (中): 包括超材料层和孔径接地平面的平行至波导过渡
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Application No.: US12763683Application Date: 2010-04-20
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Publication No.: US08576023B1Publication Date: 2013-11-05
- Inventor: Michael J. Buckley , Wajih A. El Sallal , Brian J. Herting , John C. Mather
- Applicant: Michael J. Buckley , Wajih A. El Sallal , Brian J. Herting , John C. Mather
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agent Donna P. Suchy; Daniel M. Barbieri
- Main IPC: H01P5/107
- IPC: H01P5/107

Abstract:
The present invention is directed to an interface for connecting a waveguide manifold of a transition to a stripline manifold of the transition. The interface may include a plurality of metamaterial layers, each including a metamaterial(s). The interface may further include a ground plane layer which may be connected to both the plurality of metamaterial layers and to the stripline manifold. Further, the interface may include a plurality of ground vias which may form channels through each of the layers of the interface and through the stripline manifold for providing a ground structure for the interface. The interface is further configured for forming a resonant structure which provides a low-loss, broadband conversion between a stripline mode and a waveguide mode for electromagnetic energy traversing through the interface between the waveguide manifold and the stripline manifold.
Information query