Invention Grant
- Patent Title: Manufacturing processes of backplane for segment displays
- Patent Title (中): 分段显示器背板的制造工艺
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Application No.: US11364843Application Date: 2006-02-27
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Publication No.: US08576162B2Publication Date: 2013-11-05
- Inventor: Gary Y. M. Kang , Ryne M. H. Shen , Fei Wang , Yi-Shung Chaug
- Applicant: Gary Y. M. Kang , Ryne M. H. Shen , Fei Wang , Yi-Shung Chaug
- Applicant Address: US CA Fremont
- Assignee: Sipix Imaging, Inc.
- Current Assignee: Sipix Imaging, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Perkins Coie LLP
- Main IPC: G09G3/34
- IPC: G09G3/34 ; H05K1/00 ; C09K19/52

Abstract:
The present invention relates to design and processes for the manufacture of backplane for segment displays. The process comprises: a) forming conductive lines on a non-conductive substrate layer; b) covering the conductive lines with a photoimageable material; c) forming conductive areas connected to the conductive lines and embedded in the photoimageable material; d) plating a conductive material over the photoimageable material to form segment electrodes; and e) optionally filling gaps between said segment electrodes with a thermal or radiation curable material followed by hardening said thermal or radiation curable material.
Public/Granted literature
- US20060215106A1 Design and manufacturing processes of backplane for segment displays Public/Granted day:2006-09-28
Information query
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