Invention Grant
- Patent Title: Casing structure for electronic devices
- Patent Title (中): 电子设备外壳结构
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Application No.: US13765337Application Date: 2013-02-12
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Publication No.: US08576372B2Publication Date: 2013-11-05
- Inventor: Gang Ji , Tetsuya Ohtani , Takayuki Morino , Akinori Uchino
- Applicant: Lenovo (Singapore) Pte. Ldt.
- Applicant Address: SG Singapore
- Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ference & Associates LLC
- Main IPC: G02F1/13
- IPC: G02F1/13 ; G02F1/1333

Abstract:
An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
Public/Granted literature
- US20130147079A1 CASING STRUCTURES FOR ELECTRONIC DEVICES Public/Granted day:2013-06-13
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