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US08576393B2 Method and apparatus for optical inspection, detection and analysis of double sided wafer macro defects 有权
用于光学检测，检测和分析双面晶圆宏观缺陷的方法和装置

  • Patent Title: Method and apparatus for optical inspection, detection and analysis of double sided wafer macro defects
  • Patent Title (中): 用于光学检测，检测和分析双面晶圆宏观缺陷的方法和装置
  • Application No.: US13476872
    Application Date: 2012-05-21
  • Publication No.: US08576393B2
    Publication Date: 2013-11-05
  • Inventor: Moshe Gutman
  • Applicant: Moshe Gutman
  • Agency: Kolisch Hartwell, P.C.
  • Priority: IL213025 20110519
  • Main IPC: G01N21/00
  • IPC: G01N21/00
Method and apparatus for optical inspection, detection and analysis of double sided wafer macro defects
Abstract:
Method and apparatus for detection and characterization of defects, and working order assessment of fab processing operation.
Abstract(Chinese):

检测和表征缺陷的方法和装置，以及晶圆厂加工操作的工作指令评估。

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