Invention Grant
- Patent Title: Component position measurement method
- Patent Title (中): 元件位置测量方法
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Application No.: US13890044Application Date: 2013-05-08
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Publication No.: US08576411B2Publication Date: 2013-11-05
- Inventor: Kazuhiko Takada
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2010-251662 20101110
- Main IPC: G01B11/14
- IPC: G01B11/14 ; G01N21/86 ; G01V8/00

Abstract:
In the component position measurement method, the position B of the component 1 when the laser beam is blocked (the laser beam blocking position) is measured with respect to the chuck position A of the component 1. Since the component 1 generates a large vibration (inclination) during the chuck is used, the position of the leading end (front end) C of the component 1 is computed using the inclination angle θ with respect to the measurement value of the deviation amount H of the laser beam blocking position B of the component 1 based on a similarity relationship of a triangle.
Public/Granted literature
- US20130250309A1 COMPONENT POSITION MEASUREMENT METHOD Public/Granted day:2013-09-26
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