A device for providing transient voltage suppression on a Power over Ethernet system is provided. The device includes a transient voltage suppression module. The transient voltage suppression module includes a circuit module, which includes a circuit board and input and output connectors. One or more transient voltage suppression modules may be mounted to a frame to form a transient voltage suppression patch panel, which, in turn, may be mounted to a rack for use in a telecommunications room. The circuit board combines a frequency-variable impedance connected between conductors in a pair and a voltage-variable impedance connected to the frequency-variable impedance, where the voltage-variable impedance is also connected to a chassis and/or an electrical ground.