Invention Grant
- Patent Title: Electronic component and substrate module
- Patent Title (中): 电子部件和基板模块
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Application No.: US13359520Application Date: 2012-01-27
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Publication No.: US08576538B2Publication Date: 2013-11-05
- Inventor: Yoichi Kuroda , Yoshio Kawaguchi
- Applicant: Yoichi Kuroda , Yoshio Kawaguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manuacturing Co., Ltd.
- Current Assignee: Murata Manuacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-016824 20110128
- Main IPC: H01G4/30
- IPC: H01G4/30
Abstract:
A multilayered body includes capacitor conductors and an internal conductor, which together define a capacitor. A first external electrode is connected to one of the capacitor conductors via a set of lead electrodes. A second external electrode is connected to the other capacitor conductor via another set of lead electrodes. The internal conductor faces the capacitor conductors.
Public/Granted literature
- US20120194963A1 ELECTRONIC COMPONENT AND SUBSTRATE MODULE Public/Granted day:2012-08-02
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