Invention Grant
- Patent Title: Coating composition for forming highly dielectric film and highly dielectric film
- Patent Title (中): 用于形成高介电膜和高介电膜的涂料组合物
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Application No.: US12933341Application Date: 2009-03-17
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Publication No.: US08576540B2Publication Date: 2013-11-05
- Inventor: Meiten Koh , Mayuko Tatemichi , Eri Mukai , Miharu Ota , Kouji Yokotani , Nobuyuki Komatsu
- Applicant: Meiten Koh , Mayuko Tatemichi , Eri Mukai , Miharu Ota , Kouji Yokotani , Nobuyuki Komatsu
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-071764 20080319
- International Application: PCT/JP2009/055162 WO 20090317
- International Announcement: WO2009/116527 WO 20090924
- Main IPC: H01G4/08
- IPC: H01G4/08 ; H01G4/06
Abstract:
The present invention provides a nonporous highly dielectric film which can improve withstanding voltage, insulating property and dielectric constant, especially can decrease a dielectric loss at high temperatures and can be made thin, and a coating composition for forming the highly dielectric film comprising (A) a vinylidene fluoride resin, (B) a cellulose resin and (C) a solvent.
Public/Granted literature
- US20110013343A1 COATING COMPOSITION FOR FORMING HIGHLY DIELECTRIC FILM AND HIGHLY DIELECTRIC FILM Public/Granted day:2011-01-20
Information query
