Invention Grant
- Patent Title: Line memory module form factor cooling device
- Patent Title (中): 行内存模块外形尺寸冷却装置
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Application No.: US13223389Application Date: 2011-09-01
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Publication No.: US08576560B1Publication Date: 2013-11-05
- Inventor: Pascal C. Kam , Greg Imwalle
- Applicant: Pascal C. Kam , Greg Imwalle
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.
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