Invention Grant
US08576567B2 Semiconductor device and display apparatus 有权
半导体装置及显示装置

Semiconductor device and display apparatus
Abstract:
A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.
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