Invention Grant
- Patent Title: Solid-state image pickup apparatus and X-ray inspection system
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Application No.: US12989129Application Date: 2009-04-22
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Publication No.: US08576984B2Publication Date: 2013-11-05
- Inventor: Harumichi Mori , Ryuji Kyushima , Kazuki Fujita
- Applicant: Harumichi Mori , Ryuji Kyushima , Kazuki Fujita
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2008-114214 20080424
- International Application: PCT/JP2009/058006 WO 20090422
- International Announcement: WO2009/131153 WO 20091029
- Main IPC: G01N23/04
- IPC: G01N23/04 ; G01T1/20 ; H01L27/146

Abstract:
A solid-state image pickup apparatus 1A includes a photodetecting section 10A and a signal readout section 20 etc. In the photodetecting section 10A, M×N pixel units P1,1 to PM,N are arrayed in M rows and N columns. When in a first imaging mode, a voltage value according to an amount of charges generated in a photodiode of each of the M×N pixel units in the photodetecting section 10A is output from the signal readout section 20. When in a second imaging mode, a voltage value according to an amount of charges generated in the photodiode of each pixel unit included in consecutive M1 rows in the photodetecting section 10A is output from the signal readout section 20. When in the second imaging mode than when in the first imaging mode, the readout pixel pitch in frame data is smaller, the frame rate is higher, and the gain being a ratio of an output voltage value to an input charge amount in the signal readout section 20 is greater.
Public/Granted literature
- US20110299654A1 SOLID-STATE IMAGE PICKUP APPARATUS AND X-RAY INSPECTION SYSTEM Public/Granted day:2011-12-08
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