Invention Grant
- Patent Title: Wafer surface observing method and apparatus
- Patent Title (中): 晶圆表面观察方法及装置
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Application No.: US11698987Application Date: 2007-01-29
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Publication No.: US08577119B2Publication Date: 2013-11-05
- Inventor: Hiroshi Higashi , Tetsuya Watanabe , Kenji Aiko
- Applicant: Hiroshi Higashi , Tetsuya Watanabe , Kenji Aiko
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-048136 20060224
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01N21/00

Abstract:
A wafer surface observing apparatus for inspecting a peripheral portion of an object has (A) a lens system and a CCD camera for taking images of the peripheral portion of the object, (B) storage for storing image data about the taken images, and (C) display for displaying the image data stored in the storage device. In particular, the present apparatus can have functions of rotating the object placed on a prealignment portion, recording images of one full outer periphery of an end portion of the object by the lens system and CCD camera into the location where the orientation flat portions or notched portions of the object are placed in position, accepting the images into the storage device, and displaying the images on a CRT.
Public/Granted literature
- US20070269100A1 Wafer surface observing method and apparatus Public/Granted day:2007-11-22
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