Invention Grant
US08577119B2 Wafer surface observing method and apparatus 有权
晶圆表面观察方法及装置

Wafer surface observing method and apparatus
Abstract:
A wafer surface observing apparatus for inspecting a peripheral portion of an object has (A) a lens system and a CCD camera for taking images of the peripheral portion of the object, (B) storage for storing image data about the taken images, and (C) display for displaying the image data stored in the storage device. In particular, the present apparatus can have functions of rotating the object placed on a prealignment portion, recording images of one full outer periphery of an end portion of the object by the lens system and CCD camera into the location where the orientation flat portions or notched portions of the object are placed in position, accepting the images into the storage device, and displaying the images on a CRT.
Public/Granted literature
Information query
Patent Agency Ranking
0/0