Invention Grant
US08577144B2 Connected component labeling system and method 有权
连接组件标签系统和方法

  • Patent Title: Connected component labeling system and method
  • Patent Title (中): 连接组件标签系统和方法
  • Application No.: US13595979
    Application Date: 2012-08-27
  • Publication No.: US08577144B2
    Publication Date: 2013-11-05
  • Inventor: Craig Sullender
  • Applicant: Craig Sullender
  • Applicant Address: US TX Austin
  • Assignee: eyeP, Inc.
  • Current Assignee: eyeP, Inc.
  • Current Assignee Address: US TX Austin
  • Agency: M. A. Ervin & Associates
  • Agent Michael A. Ervin
  • Main IPC: G06K9/34
  • IPC: G06K9/34
Connected component labeling system and method
Abstract:
Embodiments disclosed include methods for connected component labeling including labeling groups of raw data as one or more regions, the labeling including designating one or more data structures as containing information about the one or more regions; designating one or more of the regions as one or more subregions to expose a spatial distribution of one or more region features; and arranging at least one memory array with a 1:1 correspondence to a data array associated with the raw data to enable one or more data structures to include feature labels of the one or more subregions, the 1:1 correspondence enabling acquisition of the one or more region features with a controllable precision.
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