Invention Grant
- Patent Title: Bump validation
- Patent Title (中): 凸起验证
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Application No.: US12699692Application Date: 2010-02-03
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Publication No.: US08577292B2Publication Date: 2013-11-05
- Inventor: Andrew G Huibers
- Applicant: Andrew G Huibers
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Troutman Sanders LLP
- Agent James E. Schutz
- Main IPC: H04B7/00
- IPC: H04B7/00
Abstract:
A “bump” occurs when two devices at the same place at the same time indicate their intention to establish a connection for transferring information. A process for validating bumps is described.
Public/Granted literature
- US20110191823A1 Bump validation Public/Granted day:2011-08-04
Information query
