Invention Grant
- Patent Title: Electrically conductive and mechanically supportive materials for biomedical leads
- Patent Title (中): 用于生物医学引线的导电和机械支撑材料
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Application No.: US13044492Application Date: 2011-03-09
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Publication No.: US08577476B2Publication Date: 2013-11-05
- Inventor: Jeffrey Hendricks , Sarah Richardson-Burns , Amir Tehrani
- Applicant: Jeffrey Hendricks , Sarah Richardson-Burns , Amir Tehrani
- Applicant Address: US MA Boston
- Assignee: Biotectix, LLC
- Current Assignee: Biotectix, LLC
- Current Assignee Address: US MA Boston
- Agency: Senniger Powers LLP
- Main IPC: A61N1/05
- IPC: A61N1/05
Abstract:
An implantable medical lead connecting to a device header of a medical apparatus and having an electrode, a conductor, and a conductive polymer layer formed on at least a portion of the medical lead. An insulative sheath surrounds the conductive polymer layer for electrical insulation. The conductive polymer layer and insulative sheath maintain mechanical and electrical continuity of the lead in the event of fracture. The conductive polymer layer is composed of conductive polymers and may contain one or more dopants for improving electrical characteristics, mechanical characteristics, and processability.
Public/Granted literature
- US20110301677A1 ELECTRICALLY CONDUCTIVE AND MECHANICALLY SUPPORTIVE MATERIALS FOR BIOMEDICAL LEADS Public/Granted day:2011-12-08
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