Invention Grant
- Patent Title: Method and system for predicting shrinkable yield for business assessment of integrated circuit design shrink
- Patent Title (中): 集成电路设计业务评估收缩收益预测方法与系统收缩
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Application No.: US11486521Application Date: 2006-07-13
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Publication No.: US08577717B2Publication Date: 2013-11-05
- Inventor: Chung-Min Fu , Yu-Chyi Harn
- Applicant: Chung-Min Fu , Yu-Chyi Harn
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06Q99/00
- IPC: G06Q99/00 ; G06Q30/02 ; G06Q10/04
Abstract:
A method and a system for predicting shrinkable yield for business assessment of integrated circuit design shrink are provided. An assessment system is provided to determine cost benefits of a design shrink of an integrated circuit chip. A cost benefit analysis across different design shrink technologies is provided early in the process, so that business decisions regarding employment of design shrinks can be made as early as possible.
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