A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.