Invention Grant
- Patent Title: Optical module, wafer scale package, and method for manufacturing those
- Patent Title (中): 光模块,晶圆片封装及其制造方法
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Application No.: US12809395Application Date: 2008-12-16
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Publication No.: US08582022B2Publication Date: 2013-11-12
- Inventor: Hartmut Rudmann
- Applicant: Hartmut Rudmann
- Applicant Address: SG Singapore
- Assignee: Heptagon Micro Optics Pte. Ltd.
- Current Assignee: Heptagon Micro Optics Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Rankin, Hill & Clark LLP
- International Application: PCT/CH2008/000533 WO 20081216
- International Announcement: WO2009/076789 WO 20090625
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
An optical module for an electro-optical device with a functional element, in particular for a camera device, and to an electro-optical device with such a module. The optical module includes a lens substrate portion with at least one lens element, and a spacer. The spacer serves to keep the lens substrate at a well defined axial distance from a base substrate portion of the fully assembled electro-optical device. In order to ensure improved performance of the functional element, an EMC shield is provided. The spacer is at least in parts electrically conductive and thus forms the EMC shield or a part thereof. A method of manufacturing a plurality of such modules on a wafer scale is also provided.
Public/Granted literature
- US20110050979A1 OPTICAL MODULE, WAFER SCALE PACKAGE, AND METHOD FOR MANUFACTURING THOSE Public/Granted day:2011-03-03
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