Invention Grant
US08582298B2 Passive cooling enclosure system and method for electronics devices
有权
被动冷却机壳系统和电子设备的方法
- Patent Title: Passive cooling enclosure system and method for electronics devices
- Patent Title (中): 被动冷却机壳系统和电子设备的方法
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Application No.: US12716888Application Date: 2010-03-03
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Publication No.: US08582298B2Publication Date: 2013-11-12
- Inventor: Mario Facusse , David Scott Kosch
- Applicant: Mario Facusse , David Scott Kosch
- Applicant Address: US FL Miami
- Assignee: Xyber Technologies
- Current Assignee: Xyber Technologies
- Current Assignee Address: US FL Miami
- Agency: Foley & Lardner, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; F28F7/00 ; H01B12/00 ; G06F1/20
Abstract:
An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.
Public/Granted literature
- US20100319883A1 PASSIVE COOLING ENCLOSURE SYSTEM AND METHOD FOR ELECTRONICS DEVICES Public/Granted day:2010-12-23
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