Invention Grant
- Patent Title: Modular electronics housing
- Patent Title (中): 模块化电子设备外壳
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Application No.: US13201457Application Date: 2010-02-03
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Publication No.: US08582311B2Publication Date: 2013-11-12
- Inventor: Bernd Van Giesen , Dirk Hanke , Peter Stuckmann , Stephan Lange , Matthias Niggemann , Georg Wagner , Jens Brokmann , Katrin Wibbeke , Heinz Scharlibbe , Andreas Wedler
- Applicant: Bernd Van Giesen , Dirk Hanke , Peter Stuckmann , Stephan Lange , Matthias Niggemann , Georg Wagner , Jens Brokmann , Katrin Wibbeke , Heinz Scharlibbe , Andreas Wedler
- Applicant Address: DE Detmold
- Assignee: Weidmueller Interface GmbH & Co. KG
- Current Assignee: Weidmueller Interface GmbH & Co. KG
- Current Assignee Address: DE Detmold
- Agent Lawrence E. Laubscher, Sr.; Lawrence E. Laubscher, Jr.
- Priority: DE202009002498U 20090223
- International Application: PCT/EP2010/051304 WO 20100203
- International Announcement: WO2010/094563 WO 20100826
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/04 ; H05K5/06

Abstract:
A housing for protectively enclosing a printed circuit board, including a base, and a pair of parallel spaced vertical housing side walls extending upwardly from the base to define a chamber that receives the central portion of the printed circuit board, whereby the vertical edge portions of the board extend outwardly beyond the corresponding vertical edges of the housing side walls, respectively. Vertical side members having generally U-shaped horizontal cross-sectional configurations are mounted on the outwardly extending edge portions of the printed circuit board, respectively, with the leg portions of each side member extending between the housing side walls and the printed circuit board, respectively, whereby portions of housing side walls overlap the side member leg portions. The upper end of the chamber is closed by a lid member that is fastened between the upper ends of the side members.
Public/Granted literature
- US20110299246A1 MODULAR ELECTRONICS HOUSING Public/Granted day:2011-12-08
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