Invention Grant
US08582313B2 Motherboard assembly having serial advanced technology attachment dual in-line memory module
失效
主板组件具有串行高级技术附件双列直插式内存模块
- Patent Title: Motherboard assembly having serial advanced technology attachment dual in-line memory module
- Patent Title (中): 主板组件具有串行高级技术附件双列直插式内存模块
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Application No.: US13217638Application Date: 2011-08-25
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Publication No.: US08582313B2Publication Date: 2013-11-12
- Inventor: Kang Wu , Bo Tian
- Applicant: Kang Wu , Bo Tian
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201110228499 20110810
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
A motherboard assembly includes a motherboard with a memory slot, an adapter board, and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board and a connector. An edge connector is set on a bottom edge of the circuit board. The adapter board includes a SATA interface, a hard disk drive (HDD) signal multiplier, a power interface, and an expansion SATA interface. The edge connector is connected to the memory slot and the connector is connected to the expansion SATA interface, to enable the motherboard communication with SATA DIMM modules, which are connected to the memory slots.
Public/Granted literature
- US20130039016A1 MOTHERBOARD ASSEMBLY HAVING SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE Public/Granted day:2013-02-14
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