Invention Grant
- Patent Title: Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure
- Patent Title (中): 互连结构，插入器，半导体封装以及制造互连结构的方法
-
Application No.: US12805628Application Date: 2010-08-10
-
Publication No.: US08582314B2Publication Date: 2013-11-12
- Inventor: Seung Wook Park , Young Do Kweon , Seung Wan Shin , Mi Jin Park , Kyung Seob Oh
- Applicant: Seung Wook Park , Young Do Kweon , Seung Wan Shin , Mi Jin Park , Kyung Seob Oh
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2010-0004850 20100119
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.
Public/Granted literature
Information query
