Invention Grant
- Patent Title: High-frequency device and wireless IC device
- Patent Title (中): 高频设备和无线IC设备
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Application No.: US13094928Application Date: 2011-04-27
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Publication No.: US08583043B2Publication Date: 2013-11-12
- Inventor: Noboru Kato , Nobuo Ikemoto , Yuya Dokai , Koji Shiroki
- Applicant: Noboru Kato , Nobuo Ikemoto , Yuya Dokai , Koji Shiroki
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-007255 20090116
- Main IPC: H04B7/00
- IPC: H04B7/00

Abstract:
A high-frequency device includes a wireless IC chip and a board which is coupled to the wireless IC chip and electrically connected to radiator plates, and an inductor and/or a capacitance are provided as a static electricity countermeasure element in the board. The inductor is connected in parallel between the wireless IC chip and the radiator plates, and its impedance at the frequency of static electricity is less than an impedance of the wireless IC chip.
Public/Granted literature
- US20110199713A1 HIGH-FREQUENCY DEVICE AND WIRELESS IC DEVICE Public/Granted day:2011-08-18
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