A module for containing an earpiece for an audio device, the earpiece having at least one protruding electrical contact. The module comprises a first portion and a second portion, the first portion and the second portion being opposable and forming a cavity sized to accommodate an earpiece. The module further comprises at least one electrical contact within the cavity, on one of the first portion and the second portion. The electrical contact is positioned to engage a protruding electrical contact of the earpiece positioned within the cavity.