Invention Grant
- Patent Title: Microneedle electrode
- Patent Title (中): 微针电极
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Application No.: US12790619Application Date: 2010-05-28
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Publication No.: US08588884B2Publication Date: 2013-11-19
- Inventor: Anant V. Hegde , Amit Rajguru , Daniel Rogers Burnett , Christopher Hermanson
- Applicant: Anant V. Hegde , Amit Rajguru , Daniel Rogers Burnett , Christopher Hermanson
- Applicant Address: US CA San Francisco
- Assignee: EMKinetics, Inc.
- Current Assignee: EMKinetics, Inc.
- Current Assignee Address: US CA San Francisco
- Agency: Levine Bagade Han LLP
- Main IPC: A61B5/0408
- IPC: A61B5/0408 ; A61B5/0416 ; A61B5/0478 ; A61B5/0492 ; A61N1/04

Abstract:
In certain variations, methods, systems and/or devices for enhancing conductivity of an electrical signal through a subject's skin using one or more microneedle electrodes are provided. A microneedle electrode may be applied to the subject's skin by placing the microneedle electrode in direct contact with the subject's skin. The microneedles of the microneedle electrode may be inserted into the skin such that the microneedles pierce stratum corneum of the skin up to or through dermis of the skin. An electrical signal passes or is conducted through or across the microneedle electrode and the subject's skin, where impedance of the microneedle electrode is minimal and greatly reduced compared to existing technologies.
Public/Granted literature
- US20110295100A1 MICRONEEDLE ELECTRODE Public/Granted day:2011-12-01
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