Invention Grant
- Patent Title: Installing underlayment systems
- Patent Title (中): 安装底托系统
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Application No.: US12611323Application Date: 2009-11-03
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Publication No.: US08590268B2Publication Date: 2013-11-26
- Inventor: Patrick H. Giles
- Applicant: Patrick H. Giles
- Applicant Address: US MN Hamel
- Assignee: Maxxon Corporation
- Current Assignee: Maxxon Corporation
- Current Assignee Address: US MN Hamel
- Agency: Fredrikson & Byron, P.A.
- Main IPC: E04B1/00
- IPC: E04B1/00 ; E04G21/00 ; E04G23/00

Abstract:
Methods for installing underlayment systems include the steps of laying at least one piece of a pre-formed board over at least one first portion surface area of a sub-floor. The pre-formed board is preferably fire-resistant gypsum board, which may also be water- and/or moisture-resistant. A second portion surface area of the sub-floor, which is adjacent to each first portion surface area, is designated to receive a poured underlayment after a tub is installed over the laid at least one piece of pre-formed board. In some instances, a sound mat may be laid over each first portion surface area of the sub-floor, prior to laying the at least one piece of the pre-formed board, and, then, another sound mat may be laid over the second portion surface area of the sub-floor, after laying the at least one piece of pre-formed board and prior to pouring the poured underlayment.
Public/Granted literature
- US20100126110A1 INSTALLING UNDERLAYMENT SYSTEMS Public/Granted day:2010-05-27
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