Invention Grant
- Patent Title: Fluid supply contact
- Patent Title (中): 流体供应接触
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Application No.: US13055699Application Date: 2009-07-01
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Publication No.: US08590742B2Publication Date: 2013-11-26
- Inventor: John A. Devos , Michael M. Morrow
- Applicant: John A. Devos , Michael M. Morrow
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2009/049414 WO 20090701
- International Announcement: WO2010/014340 WO 20100204
- Main IPC: B67D7/22
- IPC: B67D7/22

Abstract:
An apparatus and method rotate a first contact (80, 180, 380) of a fluid supply body (70, 170) into contact with a second contact (40, 140, 340) of a fluid receiving device (22, 122, 322, 522).
Public/Granted literature
- US20110121024A1 FLUID SUPPLY CONTACT Public/Granted day:2011-05-26
Information query
IPC分类: