Invention Grant
- Patent Title: Wireless IC device
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Application No.: US13585866Application Date: 2012-08-15
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Publication No.: US08590797B2Publication Date: 2013-11-26
- Inventor: Noboru Kato , Nobuo Ikemoto
- Applicant: Noboru Kato , Nobuo Ikemoto
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-133335 20080521; JP2008-239826 20080918
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and/or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.
Public/Granted literature
- US20120305657A1 WIRELESS IC DEVICE Public/Granted day:2012-12-06
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