A structure of support frame featuring fast warping up and closing is mountable to a back surface of an electronic device and includes a cover and at least one bendable mechanism. The cover is mounted to the back surface of the electronic device. The bendable mechanism is mounted to the back surface of the cover and includes at least one deformable plate that is curved and shows a circular arc form. The deformable plate is provided with a depression spot. As such, pressing down the depression spot causes the deformable plate that is of a circular arc form to undergo flattening deformation, making ends of the deformable plate fast warping up in an outward direction. With the warping portions of the deformable plate, a function of supporting or clamping can be realized to hold the electronic device on an object or be worn on a human body.