Invention Grant
- Patent Title: Pump apparatus
- Patent Title (中): 泵装置
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Application No.: US11140738Application Date: 2005-06-01
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Publication No.: US08591203B2Publication Date: 2013-11-26
- Inventor: Yoshihito Yoshihara , Yoshiaki Hamasaki , Takashi Taniwa , Katsutake Asano
- Applicant: Yoshihito Yoshihara , Yoshiaki Hamasaki , Takashi Taniwa , Katsutake Asano
- Applicant Address: JP Osaka
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2004-164502 20040602
- Main IPC: F04B35/04
- IPC: F04B35/04

Abstract:
In a pump apparatus having a reduction chamber for reducing pulsation of a hydraulic fluid pressurized in a pump section on the way of a discharge channel having an opening in the outer surface of the housing of the pump section, a remaining fluid inflow prevention pipe having one end fitted into and fixed to the discharge channel between the outer surface and the reduction chamber and the other end positioned in the reduction chamber is provided, and a seal lip for fluid-tightly sealing the space between the inner wall of the discharge channel and the one end is provided on the outer circumference of the one end. The seal lip is formed in a shape tapered toward the discharge side. Further, the outside diameter of the other end of the remaining fluid inflow prevention pipe is made larger than the inside diameter of the discharge channel.
Public/Granted literature
- US20050271533A1 Pump apparatus Public/Granted day:2005-12-08
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