Invention Grant
- Patent Title: Wire-to-board connector and wire connector
- Patent Title (中): 线对板连接器和导线连接器
-
Application No.: US13321451Application Date: 2010-05-20
-
Publication No.: US08591256B2Publication Date: 2013-11-26
- Inventor: Kotaro Kobayashi , Shigeru Akiyama
- Applicant: Kotaro Kobayashi , Shigeru Akiyama
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- Priority: JP2009-122026 20090520
- International Application: PCT/US2010/035617 WO 20100520
- International Announcement: WO2010/135556 WO 20101125
- Main IPC: H01R13/40
- IPC: H01R13/40

Abstract:
A wire to board connector assembly includes mating first and second connectors. The board (second) connector is configured for surface mounting to a circuit board and contains a plurality of surface mount terminals with a pair of contact arms defining a mating slot therebetween. The other, mating (first) connector includes a plurality of box-style terminals that are supported and restrained in place within a first connector housing. Projections are dispose in the first connector housing and extend lengthwise along the direction of the terminals and provide support for the terminals. Locking members are formed as part of the first housing and reliably engage the second housing.
Public/Granted literature
- US20120077365A1 WIRE-TO-BOARD CONNECTOR AND WIRE CONNECTOR Public/Granted day:2012-03-29
Information query