Invention Grant
- Patent Title: Electrical wiring structure
- Patent Title (中): 电气接线结构
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Application No.: US13313523Application Date: 2011-12-07
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Publication No.: US08591266B2Publication Date: 2013-11-26
- Inventor: Jun Kondo , Kazufumi Serizawa , Shu Kagami
- Applicant: Jun Kondo , Kazufumi Serizawa , Shu Kagami
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2010-273575 20101208
- Main IPC: H01R13/625
- IPC: H01R13/625

Abstract:
An electrical wiring structure of connecting between a first component and a second component with at least four lead wires includes the first component provided with first insertion portions in which the lead wires are inserted, and the first insertion portions 15 are arranged in two lines and j columns, and the second component provided with second insertion portions in which the lead wires are inserted, and the second insertion portions are in two lines and j columns. Ends of a pair of lead wires are inserted into the first insertion portions and other ends of the pair of lead wires are inserted into the second insertion portions after crossing at an intermediate part.
Public/Granted literature
- US20120149252A1 ELECTRICAL WIRING STRUCTURE Public/Granted day:2012-06-14
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