Invention Grant
- Patent Title: Lead frame, method of manufacturing a contact group, and connector
- Patent Title (中): 引线框,制造接触组的方法和连接器
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Application No.: US13537504Application Date: 2012-06-29
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Publication No.: US08591272B2Publication Date: 2013-11-26
- Inventor: Masayuki Shiratori , Shuichi Aihara , Masayuki Katayanagi , Osamu Hashiguchi
- Applicant: Masayuki Shiratori , Shuichi Aihara , Masayuki Katayanagi , Osamu Hashiguchi
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Collard & Roe, P.C.
- Priority: JP2011-224033 20111011
- Main IPC: H01R9/24
- IPC: H01R9/24

Abstract:
By using a lead frame as an intermediate member, a contact group of a connector is manufactured. The lead frame includes a plurality of first leads arranged on a plane and spaced from one another, a plurality of pairs of second leads, each pair being arranged on the plane between the first leads, and a connecting portion connecting the first and the second leads on one end side. The second leads have a pitch which is greater on the other end side than that on the one end side to make the second leads approach the first leads on the other end side, respectively. The lead frame further includes bridge portions connecting approached ones of the first and the second leads to each other at a portion where an interval between the first and the second leads is reduced.
Public/Granted literature
- US20130090022A1 LEAD FRAME, METHOD OF MANUFACTURING A CONTACT GROUP, AND CONNECTOR Public/Granted day:2013-04-11
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