Invention Grant
- Patent Title: Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
-
Application No.: US12586464Application Date: 2009-09-22
-
Publication No.: US08591638B2Publication Date: 2013-11-26
- Inventor: Yutaka Morii
- Applicant: Yutaka Morii
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Priority: JP2008-243264 20080922
- Main IPC: C23C22/05
- IPC: C23C22/05 ; C23C22/48 ; C23C22/00
Abstract:
A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.
Public/Granted literature
- US20100116870A1 Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface Public/Granted day:2010-05-13
Information query
IPC分类:
