Invention Grant
- Patent Title: Sputtering system and method for depositing thin film
- Patent Title (中): 用于沉积薄膜的溅射系统和方法
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Application No.: US12294294Application Date: 2006-03-28
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Publication No.: US08591706B2Publication Date: 2013-11-26
- Inventor: Masayoshi Yokoo , Isao Tanikawa , Norikazu Kainuma , Yoshinobu Takano
- Applicant: Masayoshi Yokoo , Isao Tanikawa , Norikazu Kainuma , Yoshinobu Takano
- Applicant Address: JP Yamagata
- Assignee: Tohoku Seiki Industries, Ltd.
- Current Assignee: Tohoku Seiki Industries, Ltd.
- Current Assignee Address: JP Yamagata
- Agency: Mattingly & Malur, PC
- International Application: PCT/JP2006/306346 WO 20060328
- International Announcement: WO2007/110937 WO 20071004
- Main IPC: C23C14/34
- IPC: C23C14/34

Abstract:
A sputtering system for depositing a thin film on the surface of a disc substrate in which high precision positioning of an inner mask and an outer mask is facilitated. The sputtering system has a mask member placed on the surface of the substrate mounted on a substrate holder to cover a partial region on the surface of the substrate. A thin film is deposited by sputtering in a region on the surface of the substrate not covered by the mask member. A section for carrying in and carrying out the substrate has mechanically holds and releases the substrate holder mounting the substrate, and mechanically holds and releases the mask member.
Public/Granted literature
- US20100006422A1 SPUTTERING SYSTEM AND METHOD FOR DEPOSITING THIN FILM Public/Granted day:2010-01-14
Information query
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