Invention Grant
- Patent Title: Molded shoe rands
- Patent Title (中): 模压鞋兰特
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Application No.: US12859087Application Date: 2010-08-18
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Publication No.: US08591784B1Publication Date: 2013-11-26
- Inventor: Brian Chung
- Applicant: Brian Chung
- Applicant Address: US CA Buena Park
- Assignee: Evolve Sports & Designs
- Current Assignee: Evolve Sports & Designs
- Current Assignee Address: US CA Buena Park
- Agent Bruce E. Weir
- Main IPC: B22D25/00
- IPC: B22D25/00

Abstract:
A variable-thickness climbing shoe rand may be fabricated by digitally scanning a variable-thickness rand prototype, transmitting scan data to a computer numerically controlled mold fabrication device, creating a rand mold with the mold fabrication device, cutting a slab of uncured high-friction rubber to fit within the mold, and curing the slab within the mold to create a variable-thickness climbing shoe rand, which may then be bonded to a climbing shoe upper and finished with little or no grinding.
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