Invention Grant
US08592024B2 Repair of perforated acoustic skins by reverse pin transfer molding
有权
通过反向销传递成型修复穿孔声表皮
- Patent Title: Repair of perforated acoustic skins by reverse pin transfer molding
- Patent Title (中): 通过反向销传递成型修复穿孔声表皮
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Application No.: US11441893Application Date: 2006-05-26
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Publication No.: US08592024B2Publication Date: 2013-11-26
- Inventor: Daniel M. Stadtlander , William Bogue
- Applicant: Daniel M. Stadtlander , William Bogue
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Carlson, Gaskey & Olds
- Main IPC: B32B3/12
- IPC: B32B3/12
Abstract:
A method of restoring a section of a composite includes the steps of removing an undesirable section of a perforated composite and depositing a repair material in the location of the removed, undesirable section. The repair material is then cured. Before completing the curing step, one or more opening are formed through the repair material to produce one or more perforations through the repair material upon completing the curing step.
Public/Granted literature
- US20070275212A1 Repair of perforated acoustic skins by reverse pin transfer molding Public/Granted day:2007-11-29
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