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US08592130B2 Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board 失效
光敏树脂组合物，感光元件，抗蚀图案的形成方法和制造印刷电路板的方法

Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board
Abstract:
A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R1, R2, R4 each independently represents a hydrogen atom or a methyl group, R3 is C1-C3 alkyl group, etc., m is an integer of 0-5, R5, R6 and R7 each independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R5, R6 and R7 are C1-C5 alkyl groups.]
Abstract(Chinese):

1.一种感光性树脂组合物，其含有：（A）具有式（I），（II）和（III）表示的二价基团的粘合剂聚合物; （B）光聚合化合物; 和（C）光聚合引发剂。 [式（I），（II）和（III）中，R 1，R 2，R 4各自独立地表示氢原子或甲基，R 3为C 1〜C 3烷基等，m为0〜5的整数 ，R 5，R 6和R 7各自独立地表示氢原子或C 1 -C 5烷基，R 5，R 6和R 7中的至少两个为C 1 -C 5烷基。

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