Invention Grant
- Patent Title: Method for manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13467408Application Date: 2012-05-09
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Publication No.: US08592251B2Publication Date: 2013-11-26
- Inventor: Miyuki Hosoba , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
- Applicant: Miyuki Hosoba , Junichiro Sakata , Hiroki Ohara , Shunpei Yamazaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2009-264768 20091120
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An object is to provide a semiconductor device having stable electric characteristics in which an oxide semiconductor is used. An oxide semiconductor layer is subjected to heat treatment for dehydration or dehydrogenation treatment in a nitrogen gas or an inert gas atmosphere such as a rare gas (e.g., argon or helium) or under reduced pressure and to a cooling step for treatment for supplying oxygen in an atmosphere of oxygen, an atmosphere of oxygen and nitrogen, or the air (having a dew point of preferably lower than or equal to −40° C., still preferably lower than or equal to −50° C.) atmosphere. The oxide semiconductor layer is thus highly purified, whereby an i-type oxide semiconductor layer is formed. A semiconductor device including a thin film transistor having the oxide semiconductor layer is manufactured.
Public/Granted literature
- US20120220078A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-08-30
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