Invention Grant
US08592258B2 Semiconductor package and method of attaching semiconductor dies to substrates
失效
半导体封装以及将半导体管芯附着于衬底的方法
- Patent Title: Semiconductor package and method of attaching semiconductor dies to substrates
- Patent Title (中): 半导体封装以及将半导体管芯附着于衬底的方法
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Application No.: US13278152Application Date: 2011-10-20
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Publication No.: US08592258B2Publication Date: 2013-11-26
- Inventor: Denver Paul C. Castillo , Bryan Soon Hua Tan , Rodel Manalac , Kian Teng Eng , Pang Hup Ong , Soo Pin Chow , Wolfgang Johannes Hetzel , Werner Josef Reiss , Florian Ammer
- Applicant: Denver Paul C. Castillo , Bryan Soon Hua Tan , Rodel Manalac , Kian Teng Eng , Pang Hup Ong , Soo Pin Chow , Wolfgang Johannes Hetzel , Werner Josef Reiss , Florian Ammer
- Applicant Address: SG Singapore DE
- Assignee: United Test and Assembly Center, Ltd.,QIMONDA AG
- Current Assignee: United Test and Assembly Center, Ltd.,QIMONDA AG
- Current Assignee Address: SG Singapore DE
- Agency: Horizon IP Pte. Ltd.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
Public/Granted literature
- US20120034738A1 SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES Public/Granted day:2012-02-09
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