Invention Grant
- Patent Title: Ultra-thin wafer system and method of manufacture thereof
- Patent Title (中): 超薄晶圆系统及其制造方法
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Application No.: US11163116Application Date: 2005-10-05
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Publication No.: US08592286B2Publication Date: 2013-11-26
- Inventor: Heap Hoe Kuan , Byung Tai Do
- Applicant: Heap Hoe Kuan , Byung Tai Do
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent I-Chang John Yang
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
An ultra-thin wafer system providing thinning a wafer on a protective tape to an ultra-thin thickness and forming electrical interconnects on the thinned wafer on a support plate.
Public/Granted literature
- US20070075421A1 ULTRA-THIN WAFER SYSTEM Public/Granted day:2007-04-05
Information query
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