Invention Grant
- Patent Title: Thermosetting composition
- Patent Title (中): 热固性组合物
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Application No.: US12419618Application Date: 2009-04-07
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Publication No.: US08592533B2Publication Date: 2013-11-26
- Inventor: Hiroyuki Katayama
- Applicant: Hiroyuki Katayama
- Applicant Address: JP Ibaraki-shi
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-128679 20080515
- Main IPC: C08F283/00
- IPC: C08F283/00 ; C08F283/12 ; C08G77/00
Abstract:
A thermosetting composition containing an aluminosiloxane and an epoxy silicone. The thermosetting composition of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).
Public/Granted literature
- US20090283719A1 THERMOSETTING COMPOSITION Public/Granted day:2009-11-19
Information query
