Invention Grant
- Patent Title: Signal line and circuit substrate
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Application No.: US13343740Application Date: 2012-01-05
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Publication No.: US08592687B2Publication Date: 2013-11-26
- Inventor: Noboru Kato , Jun Sasaki , Satoshi Ishino
- Applicant: Noboru Kato , Jun Sasaki , Satoshi Ishino
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-164820 20090713
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.
Public/Granted literature
- US20120097433A1 SIGNAL LINE AND CIRCUIT SUBSTRATE Public/Granted day:2012-04-26
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