Invention Grant
- Patent Title: Circuit board having circumferential shielding layer
- Patent Title (中): 具有圆周屏蔽层的电路板
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Application No.: US13241300Application Date: 2011-09-23
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Publication No.: US08592690B2Publication Date: 2013-11-26
- Inventor: John Chow , Yueh-Shan Shih , Yong-Chun Xu , Jian-She Hu
- Applicant: John Chow , Yueh-Shan Shih , Yong-Chun Xu , Jian-She Hu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN201110080606 20110331
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A circuit board (100) includes a first shielding layer (20) extending horizontally, an accessorial shielding layer, a signal circuit layer (3) positioned between the first shielding layer and the accessorial shielding layer, and a circumferential shielding layer (6) surrounding the circuit board and electrically connecting with the first shielding layer and the accessorial shielding layer to improve shielding effect.
Public/Granted literature
- US20120247826A1 CIRCUIT BOARD HAVING CIRCUMFERENTIAL SHIELDING LAYER Public/Granted day:2012-10-04
Information query
