Invention Grant
- Patent Title: Electronic device housing
- Patent Title (中): 电子设备外壳
-
Application No.: US12966108Application Date: 2010-12-13
-
Publication No.: US08592693B2Publication Date: 2013-11-26
- Inventor: Bin Dai
- Applicant: Bin Dai
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis & Wispro Law Group, Inc.
- Priority: CN201010245080 20100804
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H05K5/00 ; H04M1/00
Abstract:
An electronic device housing includes a first housing, a second housing, a plurality of frames, and a plurality of fixing members. The first housing includes a bottom plate and a side plate extending from an edge of the bottom plate. The side plate is welded to the second housing. The frames are welded to the first housing. The fixing members fix the second housing to the frames.
Public/Granted literature
- US20120031667A1 ELECTRONIC DEVICE HOUSING Public/Granted day:2012-02-09
Information query
